EG 4090 Spec Sheet
EG 4090 Spec Sheet (Typical)
| WAFER SIZE CAPACITY |
| Authentic Wafer Sizing for 100mm, 125mm, 150mm, 200mm (4″, 5″, 6″, 8″) |
| WAFER HANDLING |
| 1 cassette of 25 or 26 slots |
| Sequential |
| Programmable access controllable via external I/O |
| Auxillary wafer tray |
| Quick single wafer insertion and extraction |
| Cross slot wafer detection |
| Quickloader station |
| Intelligent Quickload pipelining |
| ACCURACY |
| ± 4µm (system accuracy includes X, Y, Ø and Z)** |
| **definition available upon request |
| XY POSITIONING |
| Travel – 19.80″ (503mm) X, 9.42″ (239mm) Y |
| Maximum Speed – 10.0 in/sec (254.0 mm/sec) |
| Maximum Acceleration – 1.1G X axis, 0.53G Y axis |
| Resolution – 0.01 mils (0.25µm) |
| Repeatability – 0.01 mils (0.25µm) |
| Z-STAGE |
| Resolution Z | 0.25 mil | 0.125mil |
| Load | 25lbs (11.3kgs) | 40lbs (18.0 kgs) |
| Speed | 390 µsec/step | 390 µsec/step |
| Probing Range | 230 mil (5.8mm) | 230 mil (5.8mm) |
| Travel-Full | 400 mil (10.2mm) | 400 mil (10.2mm) |
| Repeatability Z | 0.25 mil (6.4µm) | 0.125 mil (3.2µm) |
| ø Travel | ±5º | ±5º |
| o Resolution | 0.000917º/step | 0.000917º/step |
| CHUCK TOPS |
| Standard – ambient probing |
| Hot – ambient to 130ºC |
| Specials – other ranges (hot and cold) available |
| Available in Au, Ni, AI (unplated) |
| AUTOMATION |
| PTPA* – Probe to Pad Alignment, Aluminized wafer, DPS II (Direct Probe Sensor II), APPV (Automatic Probe Position Verification) |
| PTPO* – Probe to Pad Optimization |
| OCR* – Optical Character Recognition |
| PMI* – Probe Mark Inspection |
| IDI* – Ink Dot Inspection |
| STAA – Self Teach Auto Align |
| WSSC – Wafer Stepping and Scaling Calibration |
| APCC* – Automatic Probe Cleaning and Continuity Pad |
| SYSTEM ARCHITECTURE |
| Multiple processors based around a Pentium™ core |
| Flash memory (core program) |
| PCI bus internal PCBs (Serial and Video) |
| PCI bus Ethernet PCB providing 10 and 100 MHz I/O speeds * |
| INTERFACE CAPABILITIES |
| Tester Interface Packages |
| All major ATE manufacturers |
| Motorized Probe Card Theta or Semi-Automatic Probe Card Changer are available on a variety of tester application packages |
| GEM – Generic Equipment Model* |
| SEMI standard communications for factory automation and control |
| AUI – Advanced User Interface |
| FPD – Flat Panel Display, 10.4″ Active Matrix Display |
| Touch Screen – Standard Feature |
| Elastomer Keyboard* – Cleanroom compatible AT style |
| NETWORKING AND TESTER COMMUNICATIONS |
| Standard Interfaces: RS232C, TTL (Parallel I/O), GPIB (IEEE-488) |
| Standard Protocols: EG Enhanced, RDP |
| Interface Protocols*: Ethernet (10/100 Mbps), GEM/HSMS compliant |
| SOFTWARE |
| EGCommander A modular, object oriented software system designed for a balance of test environment flexibility and operational ease of use |
| Design Feature Benefits: |
| User Configurable Operator Screens |
| Permits the user to set up simple operating screens for production use while maintaining the power and flexibility of EGCommander |
| Recipe Structured |
| Probing process customization and optimization |
| Graphic Control Map Editor |
| Designed probing modes to maximize productivity |
| Checklists |
| Ensures repeatable probing process |
| EG Prober Vision Compatible |
| Transfer most current Electroglas 2000/3000 test programs |
| DIMENSIONS |
| Footprint – 45.3″ (115 cm)W x 35.2″ (89.4cm) D x 34.2″ (88cm) H |
| Weight – 1027 lbs (462 kgs) |
| FACILITY REQUIREMENTS |
| Electrical: | VOLTS | AMPS | Hz |
| 100 | 16.5 | 50/60 | |
| 115 | 15 | 50/60 | |
| 230 | 7.5 | 50/60 |
| Air: | minimum 85 psi CDA, 3.0 SCFM |
| Vacuum: | 22 in Hg minimum |
* optional