TSK UF200 Spec Sheet
Accuracy | 4 Microns | |
Wafer Size | 5, 6, and 8 inch | |
Maximum X/Y Speed | 200 mm (8″) / sec. | |
UF200 Processor |
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Z Stage/Chuck | ||
Range | 1.36″ | |
Speed | 35 ms/0.020″ stroke | |
Rotation | ± 5º | |
Loader (wafer handler) | ||
Cassette Capacity | 1 standard; 2nd cassette optional | |
Wafer handling | robotic arm | |
Fine Alignment | CCD image processing | |
Hard Disk Drive | 100 MB | |
Floppy Disk Drive | 3.5″; 1 standard | |
Display | 10.4″ Color LCD | |
Power Consumption | Approx 1.5 KVA | |
Magnetic Optical Drive | 640MB | |
Facilities Required | ||
Air | 60 PSI @ 3 cfm. | |
Vacuum | 25 in/hg. | |
Dimensions | 44″w x 44″ D x 35.2″ H | |
Weight | 2150 lbs. |