TSK APM90A Spec Sheet

TSK APM90 Spec Sheet

Accuracy within 5 Microns / 0.2 mil (± 2.5 microns)
Wafer Size 4,5, 6, and 8 inch
Maximum X/Y Speed 200 mm (8″) / sec.
Z Stage/Chuck
Range 1.36″
Speed 35 ms/0.020″ stroke
Rotation ± 5º
Loader (wafer handler)
Cassette Capacity 1 standard; 2nd cassette optional
Wafer handling robotic arm
Fine Alignment CCD image processing
Hard Disk Drive 100 Mb
Floppy Disk Drive 3.5″; 1 standard
Display 10.4″ Color LCD
Power Consumption Approx 1.5 KVA
Facilities Required
Air 60 PSI @ 3 cfm.
Vacuum 25 in/hg.
Dimensions 44″w x 44″ D x 35.2″ H
Weight 1,650 lbs.