TSK UF3000 was developed to be the de facto standard model for the semiconductor testing process that accurately meets these needs. It is a fully automatic, ultra-high function probing machine that meets the total range of customer requirements including high-mix low-volume production for System LSI etc. or mass production for memories etc.
In addition to the high-rigidity of the machine, the probe mark inspection (PMI) features an automated adjustment sequence to guarantee 100% probe to pad contact.
The UF3000 increases through-put with ease of probe card conversion, quick set-up and improved processing capability. This enables rapid integration into 300mm wafer mass production lines.
The new high performance CPU helps to decrease set up time.
Multiple CPUs allow for parallel processing to decrease overall lot process time.
Easy conversion of probe cards
Easy set up of parameters through new Touch To Go (TTG) function. Also supports multiple languages. Selecting a new language can be done without reboot.
New image processing system enables probe to pad alignment, probe mark inspection and self-diagnostic functions.
Compliant with 200 mm and 300 mm wafers on one load-port.
Probe alignment is conducted at same height as actual probing, thereby minimizing any Z – axis error.
For ultra high rigidity, UF3000 uses a 4 axes driving mechanism (QPU: Quad Pot Unit) for Z – axis.
OTS (Optical Target Scope) enables measurement of the relative position of the cameras with absolute accuracy.
Standard Configuration includes:
Configured for 8″ or 12″ Wafers 8″ & 12″
Chuck Type (Gold or Nickel) Nickel
3.5″ 20GB Hard Disk
Single FOUP Port for 25 Wafers
Manual Wafer Inspection Transfer Unit
Dual Robotic Wafer Transport Arms
Pre-Alignment Stage Unit
Auto Needle Alignment
Advanced Wafer Alignment Unit
Alignment Camera E1-500
Dual (X & Y) Heidenhain Scales
Quad-Pod Z Stage
Color LCD Control Panel with Touch Panel Switches
Alarm Lamp Pole
Hot or Cold Chucks Available (TSK or ERS)
Wafer ID Options Available (TSK or Cognex)
Needle Cleaning Option (Wafer type, Driven Disc type,
Multi-Site Parallel Probing Option (3 to 256 Pins)
GPIB Interface Option
Ethernet Interface Option
ACC (Automatic Probe card Changer)
Image Processing Board C8200
Bump Height Settings Option
Group Index Option
Multi-Pass Probe Option